Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications.
Featuring excellent thermal cycling and shock resistance, passing 10 cycles from -55°C to +125°C with no signs of cracking, EP110F8-3 has a superior electrical insulation profile with a low dielectric constant of 2.67 as well as a low dissipation factor of 0.006, both measured at 75°F for 1 KHz.
“This toughened system provides very good flexibility and possesses a relatively high elongation of 120% – 150%. It offers a low tensile modulus of around 5,000psi – 15,000psi and a shore A hardness of 40 – 50 at room temperature,” explains Rohit Ramnath, senior product engineer at Master Bond.
EP110F8-3 has a convenient mix ratio of one to two by weight; the colour of Part A is clear while the colour of Part B is amber. It has a low mixed viscosity of 1,000cps – 2,000cps and flows readily. Working life for a 100g batch is 2 – 3 days at room temperature and can be cured within a few hours at 250°F – 300°F (121°C – 149°C).
Since its founding in 1976, Master Bond has been committed to developing epoxies, silicones, light curing systems and other speciality adhesives that meet specific customer requirements. Master Bond manufactures over 3,000 grades of specially designed formulations that are widely used across a variety of industries including electronic, medical, aerospace and optical.
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